Czochralski equipments
(four equipments: L, A, S, 6) adapted with
control diameter, max. T 1400C, air atmosphere,
pulling rate 0.1-30 mm/h, rotation rate 2-60 rpm.
Czochralski equipments with
controlled atmosphere (two equipments: C,
O) and adapted with control diameter, max. T 1400C,
pulling rate 0.5-30mm/h, rotation rate 5-60rpm.
Czochralski equipment with
controlled gas flux (one equipment: 7) adapted
with control diameter, max. T 1400 C, pulling rate
(0.033-30mm/h, rotation rate 5-60 rpm, equipped with
control diameter.
Vertical Gradient Freeze (VGF) technique for the growth of high quality CdZnTe (CZT crystals), for the growth of high quality CZT single crystals, we have designed and fabricated the five zone VGF furnace.
Bridgman oscillatory equipments
( B1, B2), 180ē rotation, max. T 1000ēC, completely
computerized, facilities to sealed ampoules. Growth
velocity 0.1-100mm/h.
Bridgman equipments with two
heating zones, max. T 1000ēC Vapor growth
possibilities, three zones of temperature, max. T
1200ēC
Liquid phase epitaxy equipment.
Horizontal with control atmosphere (H or N gas flux),
system for multilayer growth. Max. T 800ēC.
Films deposition equipment:
sputtering. Electron gun Alcatel equipment, vacuum
up to 10-6 Torr, filament heating.
COREMA - COntacless Resistivity Mapping: automatic equipment for measuring the volume resistivity of samples with a range of 10E5-10E10 ohm.cm
a) Glove box: for
sample preparation in inert atmosphere. Inert gas
system mBraun GmbH.
b) Cutting machines:-two
diamond disk cutting machines from South Bay Tech.
(model 660), possibilities for coupling a goniometer
for sample orientation. -one diamond wire cutting
machine, from Well ( model 3242) -three nylon wire
cutting machine, from South Bay Tech.
c) Polishing machines:-developed
in our laboratory (four equipments), polishing quality
up to ŧ microns. -One commercial high quality Logitech
polishing machine (model PM5) optical quality.
d) Sample orientation:-3D
goniometer adapted to the diamond disk cutting machine
(2 goniometers) -Software support for sample orientation
based on X-ray Laue orientation
e) post growth treatment:-furnaces
for annealing, poling and heat treatment in controlled
atmosphere up to 1200ēC.
Microscopy facilities:Optical
microscopy (Zeiss), Balances, Grinding machine, Differential
Thermal Analysis equipment Perkin Elmer DTA 1700,
Atomic absoption Perkin Elmer, mod. 3110
Access to different techniques
of analysis through the Inter-department
Research Service, web site: http://www.uam.es/investigacion/servicios/sidi/
4. EQUIPMENT DEVELOPMENT